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| NUP8028MN Low Capacitance Transient Voltage Suppressor Array This integrated transient voltage suppressor device (TVS) is designed for applications requiring transient overvoltage protection. It is intended for use in sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applications. Its integrated design provides very effective and reliable protection for eight separate lines using only one package. These devices are ideal for situations where board space is at a premium. Features http://onsemi.com 1 8 2 7 * Low Capacitance * Low Leakage Current < 1 mA @ 3 V * ESD Ratings: IEC61000-4-2, 18 kV (Contact) IEC61000-4-2, 30 kV (Air) Machine Model = Class C, 400 V Human Body Model = Class 3B, 8 kV DFN Package, 1.6 x 1.6 mm Moisture Sensitivity Level 1 This is a Pb-Free Device 3 6 4 5 * * * (Top View) Benefits MARKING DIAGRAM 8 1 DFN8 CASE 506AK 1 5S G G * Provides Protection for ESD Industry Standards: IEC 61000, HBM * Protects the Line Against Transient Voltage Conditions in Either * * * * * * * Direction Minimize Power Consumption of the System Minimize PCB Board Space 5S = Specific Device Code M = Date Code G = Pb-Free Package (Note: Microdot may be in either location) Applications ESD Protection for Data Lines Wireless Phones Handheld Products Notebook Computers LCD Displays PIN CONNECTIONS 8 GND 7 6 5 (Bottom View) 1 2 3 4 ORDERING INFORMATION Device NUP8028MNT1G Package DFN8 (Pb-Free) Shipping 3000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. (c) Semiconductor Components Industries, LLC, 2006 1 September, 2006 - Rev. 0 Publication Order Number: NUP8028MN/D NUP8028MN MAXIMUM RATINGS Parameter ESD Discharge IEC61000-4-2 Air Discharge Contact Discharge Peak Power Dissipation (8 x 20 mS @ TA = 25C) Operating Temperature Range Storage Temperature Range Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) Ppk (Note 1) TOP TSTG TL Symbol VPP 15 8.0 20 -40 to 85 -55 to 150 260 W C C C Value Unit kV Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Nonrepetitive current per Figure 4. ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted) Parameter Maximum Reverse Working Voltage Breakdown Voltage Leakage Current Clamping Voltage Capacitance Capacitance Symbol VRWM VBR IR Vc Cd Cd IR = 1.0 mA VRWM = 3.3 V IPP = 1.6 A f = 1 MHz, VR = 0 V f = 1 MHz, VR = 3.0 V 13 7.0 5.3 5.6 0.01 Test Conditions Min Typ Max 3.0 5.9 1.0 13 17 11.5 Unit V V mA V pF pF http://onsemi.com 2 NUP8028MN TYPICAL PERFORMANCE CURVES (TA= 25C unless otherwise specified) 100 Ppk, PEAK SURGE POWER (W) % OF RATED POWER OR IPP 110 100 90 80 70 60 50 40 30 20 10 0 10 1 1 10 t, TIME (ms) 100 1000 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (C) Figure 1. Pulse Width Figure 2. Power Derating Curve 0.16 % OF PEAK PULSE CURRENT IR, REVERSE LEAKAGE (mA) 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0 -60 -40 -20 0 20 40 60 80 100 T, TEMPERATURE (C) 100 90 80 70 60 50 40 30 20 10 0 0 tr PEAK VALUE IRSM @ 8 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms HALF VALUE IRSM/2 @ 20 ms tP 20 40 t, TIME (ms) 60 80 Figure 3. Reverse Leakage versus Temperature Figure 4. 8 x 20 ms Pulse Waveform 1 IF, FORWARD CURRENT (A) 0.1 0.01 TA = 25C 0.001 0.6 0.8 1.0 1.2 1.4 1.6 1.8 VF, FORWARD VOLTAGE (V) Figure 5. Forward Voltage http://onsemi.com 3 NUP8028MN PACKAGE DIMENSIONS DFN8 CASE 506AK-01 ISSUE C D A B PIN ONE REFERENCE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 4. EXPOSED PADS CONNECTED TO DIE FLAG. USED AS TEST CONTACTS. MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.15 0.25 1.60 BSC 0.70 0.90 1.60 BSC 0.30 0.50 0.40 BSC 0.20 --- 0.20 0.40 2X 0.15 C 2X 0.15 C 0.10 C 8X 0.08 C 8X L 8X K ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative EEE EEE EEE 1 e 8 TOP VIEW (A3) (A3) A SEATING PLANE DIM A A1 A3 b D D2 E E2 e K L SOLDERING FOOTPRINT* 0.490 0.0193 0.924 0.0364 SIDE VIEW A1 D2 4 2X C NOTE 4 E2 3X 0.200 0.0079 0.902 0.0355 5 8X b 0.10 C A B 0.05 C NOTE 3 0.400 0.0157 PITCH 0.502 0.0197 SCALE 20:1 mm inches BOTTOM VIEW *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 4 NUP8010MN/D |
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